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SET 255
Term 6
3 credits

MEMS, Sensors, and Emerging Device Technologies

This course provides a comprehensive examination of Micro-Electro-Mechanical Systems (MEMS), foundational sensor technologies, and advanced semiconductor devices driving innovation. Students will gain an understanding of MEMS design considerations, microfabrication techniques, and the operational characteristics of diverse sensor types including chemical, optical, and biological sensors. Emphasis is placed on the integration of these components into functional systems, exploring packaging challenges and reliability. Graduates will be equipped to analyze emerging device architectures, contribute to the development of next-generation smart devices, and troubleshoot sensor-based systems in semiconductor and related industries.

Prerequisites

Course outline

Lectures, virtual labs, and graded assignments — completed in your browser.

01Foundations of Microsystems Engineeringlecture
02Microfabrication Techniques for MEMSlecture
03Pressure, Acceleration, and Strain Sensinglecture
04Temperature Measurement and Controllecture
05Light Detection and Imaging Technologieslecture
06Detecting Molecules and Biological Signalslecture
07Smart Sensor Systems and Interfacinglecture
08Beyond Traditional Semiconductorslecture
09Bendable and Stretchable Electronic Circuitslecture
10Electronics for Healthcare and the Human Bodylecture
11Exploring the Quantum Realm in Deviceslecture
12Next-Generation Data Storage and AI Hardwarelecture
13Sustainable Power for Small Deviceslecture
14The Semiconductor Horizon: Innovation and Ethicslecture

Syllabus

Week 1: Introduction to MEMS and Microsystems
Week 2: MEMS Materials and Basic Fabrication Processes
Week 3: Photolithography and Etching Techniques for MEMS
Week 4: Thin Film Deposition and Wafer Bonding
Week 5: MEMS Actuators and Resonators
Week 6: Piezoresistive and Piezoelectric Sensors
Week 7: Capacitive and Inductive Sensors
Week 8: Optical Sensors and Image Imagers
Week 9: Chemical and Biological Sensors
Week 10: Sensor Interfacing and Signal Conditioning
Week 11: MEMS Packaging and Reliability
Week 12: Advanced Transistor Architectures and 3D Integration
Week 13: Neuromorphic and Quantum Computing Devices
Week 14: Future Trends and Applications of Emerging Technologies